As an active design center, SSED maintains an ASIC Characterization and Analysis Lab providing our ASIC design engineers with the means to extensively test, troubleshoot and debug the Application Specific Integrated Circuits (ASICs) and Monolithic Microwave Integrated Circuits (MMICS) they develop.

Customer driven solutions exist to determine device functionality, characterize operational parameters and troubleshoot non-conforming circuits. These activities can be accomplished across a broad thermal environment and can be applied to un-diced wafers, dice and packaged devices.

We have expertise in evaluation of analog, digital, very high-speed digital, mixed-signal and RF devices.

• Development of manual and automated functional and characterization test regimes for analog, digital, and mixed-signal circuits. Thermal environments are available for testing of wafer and packaged parts including and well-beyond the Mil-Spec temperature range.
• RF S-parameter, noise and load-pull characterization
• Semiconductor parameter extraction
• Diagnostic evaluation and troubleshooting
• Laser passivation removal, circuit isolation and resistor trimming
• Automated die-level wafer probe, manual die-level probe and internal die micro-probing
• Fixture design, fabrication and construction

• Prototype packaging
• Prototype wafer dicing, including multi-project/irregular layout wafers up to 8" (200mm)
• Micro-photography